LONDON--(BUSINESS WIRE)-- nVent Electric plc, a global leader in electrical connection and protection solutions, today announced that it will unveil its latest liquid cooling innovations for high-performance computing and AI at SC24.
nVent is a leader and innovator in liquid cooling with a strong track record of solving the toughest cooling challenges for global cloud service providers and collaborating to support the future of AI computing. nVent provides standard and custom solutions for the next generation of computing supported by its global scale and capacity. It is well-positioned to deliver resilient and sustainable liquid cooling and power solutions to support AI and high-performance computing around the globe.
nVent will display its latest innovations at booth #1738, spotlighting liquid cooling for the NVIDIA GB200 platform. nVent’s complete solution includes rack and row liquid-to-liquid coolant distribution units, row-based liquid-to-air (LTA) heat rejection units, coolant distribution manifolds, rear door air-to-liquid (ATL) heat exchangers and Open Compute Project (OCP) ORV3 racks. nVent will also be displaying its AI-ready high density power management solutions, including its 100 amp smart PDU.
“Our innovative and extensive portfolio is tailored to address the specific requirements of hyperscale and multi-tenant data centers. We rely on our deep technical expertise and strong global supply chain to deliver for our customers,” said Eric Osborn, VP and general manager, data center solutions at nVent.
“nVent is well-positioned to innovate and scale our liquid cooling solutions alongside rapid design cycles from chip manufacturers, supporting the next generation of high-density computing in data centers,” said Marc Caiola, VP, data center solutions – cooling and networking at nVent.
nVent’s row-based LTA heat rejection unit is a scalable liquid cooling solution that allows data centers to support AI and high-performance workloads without relying on facility-wide liquid cooling infrastructure. nVent’s LTA solution offers a modular design allowing for easy expansion as cooling demands grow and toolless hot swappable features that provide easy installation and serviceability. nVent will be showcasing its LTA solution in its booth as well as in Lenovo’s booth, #2201.
Learn more about nVent's liquid cooling and power distribution portfolio here.
Über nVent
nVent ist ein führender globaler Anbieter von elektrischen Anschlüssen und Schutzlösungen. Wir glauben, dass unsere innovativen elektrischen Lösungen sicherere Systeme schaffen und für eine sicherere Welt sorgen. Wir entwickeln, fertigen, vermarkten, installieren und warten leistungsstarke Produkte und Lösungen, die einige der sensibelsten Ausrüstungen, Gebäude und kritischen Prozesse der Welt verbinden und schützen. Wir bieten eine umfassende Palette an Gehäusen, elektrischen Anschlüssen und Befestigungen sowie Wärmemanagementlösungen. Unsere branchenführenden Marken stehen weltweit für Qualität, Zuverlässigkeit und Innovation. Our principal office is in London and our management office is in the United States in Minneapolis. Our robust portfolio of leading electrical product brands dates back more than 100 years and includes nVent CADDY, ERICO, HOFFMAN, ILSCO, RAYCHEM and SCHROFF. Weitere Informationen finden Sie unter www.nvent.com.
nVent, CADDY, ERICO, HOFFMAN, ILSCO, RAYCHEM and SCHROFF are trademarks owned or licensed by nVent Services GmbH or its affiliates.
Stacey Wempen
Director, External Communications
nVent
612-819-6188
[email protected]
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